sfh 4715s oslon black series (850 nm) lead (pb) free produc t - rohs compliant vorl?ufige daten / preliminary data 2011-09-30 1 wesentliche merkmale ? ir-lichtquelle mit hohem wirkungsgrad ? niedriger w?rmewiderstand (max. 11 k/w) ? schwerpunktswellenl?nge 850 nm ? esd-sicher bis 2 kv nach jesd22-a114-e ? erweiterte korro sionsfestigkeit (s.a. abschnitt ma?zeichnung) anwendungen ? infrarotbeleuchtung fr kameras ? berwachungssysteme ? beleuchtung fr bilderkennungssysteme sicherheitshinweise je nach betriebsart emi ttieren diese bauteile hochkonzentrierte, nicht sichtbare infrarot- strahlung, die gef?hrlich fr das menschliche auge sein kann. produkte, die diese bauteile enthalten, mssen gem?? den sicherheits- richtlinien der iec-normen 60825-1 und 62471 behandelt werden. typ type bestellnummer ordering code strahlst?rkegruppierung 1) ( i f = 1 a, t p = 10 ms) radiant intensity grouping 1) i e (mw/sr) sfh 4715s Q65111A1549 320 (typ. 500) 1) gemessen bei einem raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr features ? ir lightsource with high efficiency ? low thermal resistance (max. 11 k/w) ? center of spectral emission at 850 nm ? esd safe up to 2 kv acc. to jesd22-a114-e ? superior corrosion robustness (see chapter package outlines) applications ? infrared illumination for cameras ? surveillance systems ? machine vision systems safety advices depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. products which incorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471.
2011-09-30 2 sfh 4715s grenzwerte ( t a = 25 c) maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op , t stg ? 40 + 125 c sperrschichttemperatur junction temperature t j + 145 c sperrspannung reverse voltage v r 1 v vorw?rtsgleichstrom forward current i f 1 a sto?strom, t p = 500 s, d = 0 surge current i fsm 5 a leistungsaufnahme power consumption p tot 3.4 w w?rmewiderstand sperrschicht - l?tstelle thermal resistance junc tion - soldering point r thjs 11 k/w kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 1 a, t p = 10 ms peak 860 nm centroid-wellenl?nge der strahlung centroid wavelength i f = 1 a, t p = 10 ms centroid 850 nm spektrale bandbreite bei 50% von i max spectral bandwidth at 50% of i max i f = 1 a, t p = 10 ms ? 30 nm abstrahlwinkel half angle ? 45 grad deg. abmessungen der aktiven chipfl?che dimension of the active chip area l b l w 1 1 mm2 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, i f = 5 a, r l = 50 switching times, e from 10% to 90% and from 90% to 10%, i f = 5 a, r l = 50 t r / t f 7 / 14 ns
sfh 4715s 2011-09-30 3 durchlassspannung forward voltage i f = 1 a, t p = 100 s i f = 5 a, t p = 100 s v f v f 3.0 (< 3.4) 3.5 (< 4.5) v v gesamtstrahlungsfluss total radiant flux i f = 1 a, t p = 100 s e 1070 mw temperaturkoeffizient von i e bzw. e temperature coefficient of i e or e i f = 1 a, t p = 10 ms tc i ? 0.3 %/k temperaturkoeffizient von v f temperature coefficient of v f i f = 1 a, t p = 10 ms tc v ? 2 mv/k temperaturkoeffizient von temperature coefficient of i f = 1 a, t p = 10 ms tc , centroid + 0.3 nm/k kennwerte ( t a = 25 c) characteristics (cont?d) bezeichnung parameter symbol symbol wert value einheit unit
2011-09-30 4 sfh 4715s abstrahlcharakteristik radiation characteristics i rel = f ( ? ) strahlst?rke i e in achsrichtung 1) gemessen bei einem raumwinkel = 0.01 sr radiant intensity i e in axial direction at a solid angle of = 0.01 sr bezeichnung parameter symbol werte values einheit unit -cb -da -db strahlst?rke radiant intensity i f = 1 a, t p = 10 ms e min e max 320 500 400 630 500 800 mw/sr mw/sr 1) nur eine gruppe in einer verpack ungseinheit (streuung kleiner 1.6:1) / only one group in one packing unit (variation lower 1.6:1) ohl04470 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ?
sfh 4715s 2011-09-30 5 relative spektrale emission relative spectral emission i rel = f ( ) max. zul?ssiger durchlassstrom max. permissible forward current i f = f ( t a ), r thjs = 11 k/w 700 0 nm % ohf04132 20 40 60 80 100 950 750 800 850 i rel t s 700 600 800 f i 900 ma 1100 ohf05030 20 40 60 80 100 140 durchlassstrom forward current i f = f ( v f ) single pulse, t p = 100 s zul?ssige impulsbelastbarkeit permissible pulse handling capability i f = f ( t p ), t s = 85 c, duty cycle d = parameter ohf04188 f i v a 2 f v 10 -1 5 10 0 5 10 1 10 -2 2.5 3 3.5 4 10 10 0 -2 -3 -4 -5 10 10 10 f i a p t = d t 2 1 0 -1 10 t p 10 s 10 ohf05031 t t p i f 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.5 0.05 0.2 0.1 0.02 0.01 = 0.005 d 1 0.5 relativer gesamtstrahlungsfluss relative total radiant flux e / e (1a) = f ( i f ) single pulse, t p = 100 s ohf04187 i f a 10 -1 510 0 510 1 1 10 -2 10 -3 10 5 10 10 5 -1 5 0 e (1 a) e 10 -2
2011-09-30 6 sfh 4715s ma?zeichnung 1) package outlines note: die ired enth?lt ein esd-schutzbauteil, das parall el zum chip geschaltet ist. / ired is protected by esd device which is connected in parallel to chip. note: das geh?use ist fr ultraschallreinigung nicht geeignet. / package is not suitalbe for ultra sonic cleaning. korrosionsfestigkeit besser als en 60068-2-60 (method 4): mit erweitertem korrosionstest: 40c / 90%rh / 15ppm h2s / 336h corrosion robustness better th an en 60068-2-60 (method 4): with enhanced corrosion test: 40c / 90%rh / 15ppm h2s / 336h anodenkennung: anodenpad ist abgeschr?gt und weist zur kathode anode mark: anode pad has chamfered edge, which points to cathode gewicht / approx. weight: 32 mg 1) ma?e in mm (inch) / dimensions in mm (inch)
sfh 4715s 2011-09-30 7 gurtung / polarit?t und lage 1) verpackungseinheit 600/rolle, ?180 mm method of taping / polarity and orientation packing unit 600/reel, ?180 mm 1) ma?e in mm (inch) / dimensions in mm (inch)
2011-09-30 8 sfh 4715s empfohlenes l?tpaddesign 1) recommended solder pad design 1) ma?e in mm (inch) / dimensions in mm (inch)
sfh 4715s 2011-09-30 9 l?tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 reflow l?tprofil fr bleifreies l?ten (nach j-std-020d.01) reflow soldering profile for lead free soldering (acc. to j-std-020d.01) profileigenschaften profile feature bleifreier aufbau / pb-free assembly (snagcu) empfehlung / recommendation grenzwerte / max. ratings aufheizrate zum vorw?rmen* ) / ramp-up rate to preheat* ) 25 c to 150 c 2 k / s 3 k / s zeit t s von t smin bis t smax / time t s from t smin to t smax 150 c to 200 c 100 s min. 60 s max. 120 s aufheizrate zur spitzentemperatur* ) / ramp-up rate to peak* ) 180 c to t p 2 k / s 3 k / s liquidustemperatur t l / liquidus temperature t l 217 c zeit t l ber t l / time t l above t l 80 s max. 100 s spitzentemperatur t p / peak temperature t p 245 c max. 260 c verweilzeit t p innerhalb des spezifizierten spitzentemperaturbereichs t p - 5 k / time t p within the specified peak temperature range t p - 5 k 20 s min. 10 s max. 30 s abkhlrate* ) / ramp-down rate* ) t p to 100 c 3 k / s 6 k / s maximum zeitspanne von 25 c bis zur spitzentemperatur / time from 25 c to peak temperature max. 8 min. alle temperaturen beziehen sich auf die bauteilmitte, jeweils auf der bauteiloberseite gemessen / all temperatures refer to the center of the package, measured on the top of the package * steigungsberechnung t/ t: t max. 5 s; erfllt ber den gesamten temperaturbereich / slope calculation t/ t: t max. 5 s; fulfillment for the whole t-range 0 0 s oha04525 50 100 150 200 250 3 00 50 100 150 200 250 3 00 t t ?c s t t p t t p 240 ?c 217 ?c 245 ?c 25 ?c l
2011-09-30 10 sfh 4715s published by osram opto semico nductors gmbh leibnizstra?e 4, d-93055 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered.
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